DFM PCB FORM

With the help of this form it is possible to easily enquire PCB manufactures regarding key technological points involve in PCBs production. This will help you to defining your design’s constraints in order to get the right balance between PCB costs production and required technological skills from PCB manufactures.

INSTRUCTIONS

Fill the form as request. Please insert for each parameter the EASY / MEDIUM / HARD values. If you’d like to omit one of them please use the following notation EASY / X / HARD (ex. 8 / x / 3 ).

With “EASY / MEDIUM / HARD” we are referring to three different grades of manufacturing difficulties. Certain features have the possibilities to differentiate between internal and external layer.

At the end of the form you will be asked to insert your details and the email of the person you’d like to send the filled form.

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1. MINIMUM TRACE WIDTH

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2. MINIMUM TRACE TO TRACE CLEARANCE

  • s-splen2
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3. MINIMUM PAD TO TRACE CLEARANCE

  • s-cad_self1
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4. MINIMUM NPTH TO TRACE CLEARANCE

  • ss-npthpadcl
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5. MINIMUM PAD-VIA TO TRACE CLEARANCE

  • s-p2c1
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6. MINIMUM PAD-VIA TO COPPER-PLANES CLEARANCE

  • nfp_pia
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7. MINIMUM NPTH TO COPPER PLANES CLEARANCE

  • neg_ar_via
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8. MINIMUM DRILL-VIAS TO COPPER PLANES CLEARANCE

  • pth2p
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9. MINIMUM VIAS DRILL-HOLE SIZE

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10. MINIMUM VIAS ANULAR-RING

  • via_ar_pia
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11. MINIMUM DRILL TO DRILL DISTANCE

  • exvia2exvia
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12. MINIMUM VIA-PAD TO VIA-PAD CLEARANCE

  • via2via
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13. MINIMUM SOLDER GAP ON SMD PADS

  • MPS
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14. MINIMUM SOLDER TRACE BETWEEN SMD PAD

  • MTS
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15. TOLLERANCE ON CONTROLLED IMPEDENCE TRACES

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YOUR DETAILS

 

Please Confirm

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